多孔陶瓷电路板，适用于搭配电子元件使用，并包含一由多孔陶瓷制成的基板，及一被覆于该基板顶面并构成一预定电路图布而可供电子元件电连接的导电层。借由多孔陶瓷基板的多孔性结构所具有的大表面积，可快速地将该电子元件作功产生的热量散除，及可迅速降低电子元件的热量。
The porous ceramic circuit board is suitable for use with electronic components, and comprises a substrate made of porous ceramics and a conductive layer coated on the top surface of the substrate and forming a predetermined circuit layout for electrical connection of electronic components. With the large surface area of porous ceramic substrate, the heat generated by the work of the electronic component can be quickly dissipated and the heat of the electronic component can be reduced rapidly.
可用以供电子元件电连接使用，其特征在于：包含一由多孔陶瓷制成的基板，及一被覆于该基板顶面的导线单元，该导线单元包括多数个间隔被覆于该基板顶面并构成一预定电路分布图案而可供电子元件电连接的导电层。
The utility model can be used for the electrical connection of electronic components, which is characterized in that: it comprises a substrate made of porous ceramics and a wire unit covered on the top surface of the substrate, and the conductor unit comprises a plurality of conductive layers with intervals covering the top surface of the substrate and forming a predetermined circuit distribution pattern for the electrical connection of electronic components.